METHOD OF PRODUCTION OF COPPER LOW-PROFILE FOIL AND LOW-PROFILE FOIL PRODUCED WITH IMPLEMENTATION OF THIS METHOD Russian patent published in 2009 - IPC C25D1/04 

FIELD: metallurgy.

SUBSTANCE: invention refers to hydro-metallurgy and can be implemented at production of copper foil for foiled dielectric and for printed circuit boards. The method consists in solving copper and in producing electrolyte on base of sulphuric acid with contents of chloride ions, and in settling layer of copper on external surface of a rotating drum under effect of electric current, when negative potential is supplied onto the drum, while positive potential is supplied to bent sheets of anodes located in electrolyte; also additives preliminary dissolved in water in form of gelatine, hydroxyethylcellulose and high molecular additive with molecular weight not less, than 600 000 are introduced into electrolyte; notably, gelatine and hydroxyethylcellulose are dissolved in water together, while high molecular additive is dissolved in water separately. Low profiled foil produced by this method contains dull and glossy finish located on opposite sides and possesses uniform columnar structure at average dimensions of crystals 4-7 mcm in cross section, while its dull surface morphology is characterized with presence of pyramid bumps.

EFFECT: upgraded quality of copper foil and complete exclusion of outgrowth occurring on its surface; also improved structure.

8 cl, 11 dwg, 3 tbl