COPPER FOIL FOR MANUFACTURING OF PRINTED CIRCUIT BOARDS AND METHOD FOR ITS PRODUCTION Russian patent published in 1999 - IPC

FIELD: printed circuit boards. SUBSTANCE: method involves protection of copper foil surface from oxidation and generation of oxide film by means of electrolytic deposition of protection layer which contains metallic zinc and at least one composition of triad chrome. This protection layer is easy to be removed by dissolving in water alkali solution. Preferable weight ratio of zinc to chrome is 1:1 or more. Copper foil produced by electrolytic deposition may be used for multilayer printed circuit boards, since it has protection layer which is produced by electrolytic deposition on its dead surface, and copper processed by electrolytic deposition on its working surface. EFFECT: increased strength of connection of conducting tracks on polymer substrate, increased solidity. 7 cl, 3 dwg