COMPOSITE COPPER FOIL AND METHOD OF MANUFACTURE OF SUCH FOIL Russian patent published in 2005 - IPC

FIELD: galvanoplastics; manufacture of composite copper foil; manufacture of printed circuit boards.

SUBSTANCE: composite copper foil (10) includes carrier foil (12) electrolitycally precipitated on cathode and provided with cathode side formed in contact with cathode and opposite electrolytic side. Located on electrolytic side of carrier foil (12) is very thin separating layer (14). Thin functional foil (16) formed by precipitation of copper has front side engageable with separating layer (14) and opposite reverse side. Electrolytic side of carrier foil (12) has roughness Rz equal to or lesser than 3.5 mcm. Method of manufacture of such foil includes making carrier foil (12) on cathode by electrolytic precipitation and forming thin separating layer (14) on its electrolytic side; thin functional foil (16) is formed by precipitation of copper; front side of functional foil (16) is engageable with separating layer (14); electrolytic precipitation of carrier foil (12) is made in such way that its electrolytic side has roughness Rz lesser than or equal to 3.5 mcm.

EFFECT: low cost of foil; improved quality of functional foil surface.

26 cl, 9 dwg