FIELD: electrical engineering.
SUBSTANCE: invention is related to electrospark treatment of metals, in particular to manufacturing of complex profiled parts from foil used in structures of electronic equipment, such as frame contact elements for bodies of microcircuit chips, screens of SHF units, elements of antenna-slot arrays. Method includes assembly of foil stocks into packet with formation of separating layers between them, fixation of stocks in packet by means of facings made of sheet material, electrospark treatment of manufactured parts along edges in packet with the help of wire electrode and separation of packet into foil parts, besides separating layers in process of packet assembly are formed by application of finely dispersed powder of dielectric onto surface of each foil stock.
EFFECT: method makes it possible to perform electrospark treatment of foil stocks assembled in pack with high accuracy due to elimination of separating layer effect at foil in zone of electrospark cutting, and also provides for simplification at the stage of foil parts separation from pack with production of high-quality parts from foil.
1 ex
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Authors
Dates
2010-02-20—Published
2008-12-03—Filed