FIELD: technological processes.
SUBSTANCE: invention relates to methods of processing beryllium foil, namely, to cutting it by laser radiation, and can be used in X-ray instrument-making, in making windows for X-ray equipment. Method of cutting beryllium foil involves determining power of laser radiation and number of passes of laser beam along cutting edge depending on thickness of cut foil and further penetration of beryllium foil by pulsed laser radiation with pulse duration of 100 ns, modulation frequency of 5 kHz and speed of translational radiation beam movement of 10 mm/s.
EFFECT: increased yield of beryllium foil suitable for cutting due to absence of cutting defects in the form of non-cutting, melting, buckling, as well as high oxidation.
1 cl, 4 dwg, 3 tbl
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