FIELD: electrical engineering.
SUBSTANCE: proposed method comprises structuring the substrate and applying a layer of film material spherical nanoparticles thereon by centrifuging nanoparticles from dispersion. Note here that structuring of the substrate is effected by applying a layer of spherical nanoparticles with diametre larger than that of the film material nanoparticles with the help of centrifuging.
EFFECT: notably finer substrate structuring.
4 cl, 4 dwg, 4 tbl
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