SOLDERING PASTE Russian patent published in 2008 - IPC B23K35/363 

FIELD: technological processes.

SUBSTANCE: invention pertains to low-temperature soldering pastes and can be used in assembly of units and parts of radioelectronic equipment, for example, in manufacturing of thin-film and thick-film hybride integrated microcircuits. The paste contains the following components, % of weight: polyester resin 14-17, betula camphor 1-4, solder powder 79-85. Exclusion of clearing stage after soldering decreases quantity of the material used, operational cost, and simplifies technological process. There is no need to perform assembling after soldering in case the components are not compatible with clearing process, and therefore are soldered manually.

EFFECT: paste composition provides high temperature resistance, while reducing corrosiveness.

1 dwg, 3 tbl