METHOD OF DETERMINING ADHESION OF DIELECTRIC FILM TO SOLID BASE (VERSIONS) Russian patent published in 2010 - IPC G01N19/04 

FIELD: construction.

SUBSTANCE: method of determining adhesion of a dielectric layer (two versions) deposited on a solid base involves steps for making, preparing the specimen and taking measurements, where a grooves is made at the preparation step. Several through incisions perpendicular to the groove are made in the specimen. The dielectric layer is cut in the direction of the through incisions up to the metal base, thereby obtaining strips. The fragment of the specimen lying between the through incisions is snapped off the base and by moving the fragment to the side opposite the groove, the dielectric layer is separated from the base. The distance from the point of separation to the point of breaking is measured. The measurement result is ratio from dividing the thickness of the dielectric layer and the measured distance.

EFFECT: determination of adhesion properties of a dielectric layer.

2 cl, 3 dwg