FIELD: construction.
SUBSTANCE: method of treatment includes deposition of at least one thin film A on part of specified substrate surface, besides, stage of deposition is carried out by method of vacuum sputtering. Then with the help of at least one linear ion source, plasma is generated from ionised particles of gas or mixture of gases, and at least one part of film A surface is exposed to plasma for modification, of at least partially, surface of film A with ionised particles. Afterwards at least one thin film B is deposited on one part of film A surface, besides, besides, this stage is carried out by method of vacuum sputtering.
EFFECT: invention provides for efficiency of surface cleaning.
18 cl, 6 ex, 3 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD FOR CLEANING OF SUBSTRATE | 2005 |
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