FIELD: metallurgy.
SUBSTANCE: solution contains, wt %: copper sulphate 5-10, sulphuric acid 8-10, ethylene-diamine-tetra-acetic acid and/or its sodium salts 0.01-6 and water - the rest.
EFFECT: strong adhesion of coating to wire, increased density and uniformity of coating, reduced porosity, and increased applicability of solution for copper coating during 60-70 days.
1 tbl, 1 ex
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD FOR MANUFACTURING OF COPPERED WIRE | 2009 |
|
RU2380183C1 |
| STEEL ARTICLES CONTACT COPPER PLATING SOLUTION | 2018 |
|
RU2705050C1 |
| STEEL ARTICLES COPPER PLATING SOLUTION | 2019 |
|
RU2716910C1 |
| ELECTROLYTE OF COPPER COATING | 2006 |
|
RU2334831C2 |
| METHOD OF REGENERATION TREATMENT OF ALKALINE SOLUTIONS OF COPPER COATING | 2007 |
|
RU2343225C2 |
| COPPER-PLATING ELECTROLYTE | 0 |
|
SU857304A1 |
| COPPER-PLATING ELECTROLYTE | 0 |
|
SU945253A1 |
| AQUEOUS SOLUTION FOR CONTACT COPPER-PLATING OF ARTICLES OF LOW-CARBON STEEL | 0 |
|
SU1447930A1 |
| METHOD OF SPENT ALKALINE GALVANIC COPPER PLATING ELECTROLYTE REGENERATING | 2015 |
|
RU2603933C1 |
| STEEL COPPER PLATING ELECTROLYTE | 0 |
|
SU1303632A1 |
