FIELD: electroplating.
SUBSTANCE: invention relates to electroplating and can be used for spent solutions regeneration. Method of galvanic copper plating spent alkaline electrolyte regenerating, containing of copper cations (II) complexes with ethylene diamine tetraacetic acid (EDTA), includes reduction of copper cations (II) into copper cations (I) during heating, removal of EDTA complexon from acid solution, wherein copper cations (II) reducing agent used is sodium thiosulphate, reduction process is carried out at pH = 5-6, heating to 90 °C for 15 minutes and molar ratio υ(Cu2+):υ(thiosulfate), equal to 1:1.05 and obtained copper sulphide (I) is annealed and dissolved in sulfuric acid to produce copper oxide (II).
EFFECT: technical result is production waste water with concentration of copper cations (II) lower than MPC.
1 cl, 1 tbl, 12 ex
