FIELD: treatment of ceramic substrates, namely polishing of ceramic substrates.
SUBSTANCE: proposed method of treatment of ceramic substrate containing aluminum includes the following operations: introduction of suspension between substrate and working tool; suspension contains abrasive and additive containing oxo-phosphoric or organo-phosphoric compound at concentration between 0.05 and 5 weight-%; then, substrate is set in motion relative to working tool. Method of treatment of substrate containing aluminum includes introduction of suspension containing abrasive and additive containing in its turn oxo-phosphoric or organo-phosphoric compound at concentration between 0.05 and 5 weight-%. Substrate is brought in contact with working tool in such way that suspension is introduced between substrate and working tool; then substrate is set in motion in such way that its speed relative to working tool is no less than 2.0 m/s.
EFFECT: increased rate of removal of material; improved service characteristics.
34 cl, 5 dwg, 5 tbl
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Authors
Dates
2007-01-27—Published
2004-03-29—Filed