FIELD: machine building.
SUBSTANCE: device consists of grid of piezo-electric micro-sensors (3) grouped in form of matrix of lines and columns for measurement of vibration waves emitted with said structure in various points of surface of said structure. Further, the device consists of interface electronics (10) connecting the said grid of micro-sensors (3) with recording memory unit (11). Also, micro-sensors, electronics (10), and recording device (11) are integrated into flexible substrate (2) in cohesion with surface of the checked structure. Interface electronics (10) is positioned on the end of lines of micro-sensors or on the end of columns of micro-sensors to connect correspondingly each line and each column of the grid with interface electronics.
EFFECT: check of condition of structure during total period of its performance by means of local measurement of vibration behaviour of structure.
15 cl, 7 dwg
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