SOLDER PASTE Russian patent published in 2017 - IPC B23K35/36 B23K35/363 

Abstract RU 2623571 C1

FIELD: printing industry.

SUBSTANCE: solder paste contains, wt %: low-temperature solder powder 80…91 and the flux-bundle 9…20. The flux-bundle includes components in the following ratio, wt %: synthetic resin 30…60, a mixture of high boiling and low boiling organic solvents in the form of ethers and/or alcohols 30…60, activators in the form of a salt or a salt mixture of primary amines with organic acids 1…8, a rheological additive in the form of vegetable wax "carnauba" 1…15.

EFFECT: reliability of the soldering of highly oxidized printed-circuit boards and radio electronic components with a long shelf life, designed for operation in severe operating conditions.

1 dwg, 4 tbl

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RU 2 623 571 C1

Authors

Gryaznov Sergej Yurevich

Ivanov Nikolaj Nikolaevich

Ivin Vladimir Dmitrievich

Dates

2017-06-27Published

2016-08-17Filed