FIELD: physics.
SUBSTANCE: invention relates to microsystem engineering and can be used in designing and manufacturing micromechanical devices, having elastic, flexible deformable actuating elements which enable electric signal-to-displacement conversion and/or temperature change-to-displacement conversion for microrobotic systems. The thermal micromechanical actuator comprises a silicon monocrystalline wafer with orientation [100], having a mesostructure consisting of parallel trapezoid inserts joined by polyimide interlayers formed by a polyimide film, a heater and a heater metal coating. According to the invention, the polyimide film is made from a polypyromeltitimide layer adjacent to the parallel trapezoid inserts, which is reinforced with carbon nanotubes with functional carboxylic groups and concentration of not more than 11×10-3 g/cm3 and a non-reinforced polypyromeltitimide outer layer.
EFFECT: wider temperature range, high technological effectiveness and reliability.
10 cl, 8 dwg
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Authors
Dates
2012-04-27—Published
2010-03-25—Filed