MICROCHIP WITH MICROELECTROMECHANICAL PROTECTION FROM ELECTRICAL AND/OR THERMAL OVERLOAD Russian patent published in 2012 - IPC H03K17/08 

FIELD: physics.

SUBSTANCE: microchip with microelectromechanical protection from electrical and/or thermal overload includes at least one semiconductor integrated circuit, at least one movable thermomechanical microactuator, wherein the number of semiconductor integrated circuits is equal to the number of movable thermomechanical microactuators, a structure which is sensitive to external factors, for example: temperature, radiation, heavy charged particles, electromagnetic pulses, etc, comprising the following semiconductor integrated elements: bipolar transistors, MOS structures made in the same process cycle with the semiconductor integrated circuit, lying between pockets and/or regions with electron and hole conductivity.

EFFECT: high reliability of the protected semiconductor integrated circuit, relative simplicity of implementation, high efficiency of protection from external factors with pulsed and continuous action, reduced weight and size.

8 cl, 6 dwg