MICROSYSTEM DEVICE FOR TEMPERATURE CONTROL OF SURFACE OF SPACECRAFT Russian patent published in 2014 - IPC B81B7/00 B81B3/00 

FIELD: physics.

SUBSTANCE: microsystem device for temperature control of the surface of spacecraft includes: a base made of dielectric material with a low coefficient of heat conduction with a rectangular hole; at least two rows of independent parallel control channels consisting of microactuators arranged parallel to each other along the base (as shown on fig. 1a, b);a reflecting shield placed over the microactuators; metal-coated tracks with electrical contacts on and/or inside the base for electrical contact with the microactuators; guides of the reflecting shield mounted on the base; polyimide clamps placed between the guides of the reflecting shield and the reflecting shield. Adjacent microactuators in a row are turned towards each other at an angle of 180 degrees; the number of microactuators in each row is equal to the number of rows - which is an even number, and the number of microactuators in each row is not less than 6; the microactuators are configured for angular displacement of mobile elements by an angle of not less than 30 degrees; the reflecting shield is placed over the microactuators such that the axis of symmetry of the reflecting shield is equidistant from each pair of rows of microactuators (as shown on fig. 1a, b); the free surface of the base is coated on both sides with a material with a high coefficient of reflection; force on the mobile elements of the microactuators is such that, overall for all microactuators, it is sufficient to overcome the frictional force between the reflecting shield and the microactuators.

EFFECT: reduced weight and size owing to linear displacement of the mobile element in one plane, capacity of the system to operate in open space conditions, resistance to severe operating temperature conditions, reduced frictional losses between components of the structure, high operating efficiency of the system owing to active control and full closure of the protected surface by the reflecting shield, reducing supply voltage to on-board voltage, high reliability owing to use of microdrives which are resistant to repeated bending, low power consumption owing to an operating mode which requires system activity, and power consumption only when moving the shield, ie when changing the temperature conditions of the protected object or the ambient environment, enabling the manufacture of temperature control systems via batch methods according to standard technologies of silicon micromachining and machining components of the structure.

15 cl, 5 dwg