FIELD: electricity.
SUBSTANCE: circuit substrate with metal carrying layer on which at least locally there applied is layer of dielectric material; at that, dielectric material layer has multiple pores; at that, pores (20) at least on the side of layer of dielectric material, which is opposite to carrying layer of substrate, are filled in with glass (9).
EFFECT: increasing electrical insulating property of dielectric material layer; eliminating the problem of occurrence of short circuits.
12 cl, 5 dwg
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