METHOD OF MAKING CONDUCTING TRACKS ON POROUS POLYMER FILM Russian patent published in 2010 - IPC H05K3/10 

FIELD: physics.

SUBSTANCE: conducing tracks of given size and form are made in a porous polymer film by closing through-pores and sections of the said film outside zones for displaying conducting tracks and subsequent galvanic filling of open pores in the zones for displaying conducting tracks with metal until formation of metal layers on the surface of the polymer film. The proposed invention enables: implementation of "dry" technology of recording a graphic image of a topological printed circuit pattern on the porous polymer film without wet processing steps. The "dry" technology uses, for instance a thermal method of recording the graphical image of the topological printed circuit pattern using a laser beam directly from a computer control to a porous polymer film, and does not require reagents and dark rooms. Galvanic metallisation of the polymer film only within the graphical image of the conducting track. Prevention of formation of through openings and consequently their metallisation when making two- or more flexible multilayer printed-circuit boards. Reduction of the width of conducting tracks and distance between them to micrometre sizes. Rapid manufacture of flexible multilayer printed-circuit boards. Realisation of roll technology (roll on roll). Display of the entire topological printed circuit pattern on a single surface of a polymer film, which reduces the number of connectors. Considerable decrease in number of complex equipment and simplification of the process of making flexible multilayer printed-circuit boards. Longer service life of flexible multilayer printed-circuit boards (due to double-sided duplication of conducting tracks). Provision for favourable conditions for removing heat from one metallised surface of the polymer film to the other through metallic micro-wires.

EFFECT: design of an efficient and environmentally friendly method for making conduction tracks of given size and form directly on a polymer film, higher functionality, reliability and quality of flexible multilayer printed-circuit boards, simplification and reduced cost of the process.

2 cl, 2 dwg