FIELD: process engineering.
SUBSTANCE: invention relates to clay layer separation device. Proposed device comprises, at least, one incising device to make transverse layer incision and cutting device to cut layer in made incisions. Note here that incising device comprises incising tool arranged to displace in crosswise direction. Note also that cutting device comprise, at least, one holder to displace across layer in cutting guide. Note that incising device with its drive is arranged on reciprocating bearing module. Cutting device with holder and drive are arranged on bearing module.
EFFECT: simplified design.
20 cl, 12 dwg
