FIELD: physics.
SUBSTANCE: analysed flat sample of known thickness is brought into thermal contact with a flat reference sample on the plane through a heat source with a given thermal flux density. Outer planes of the analysed sample and reference sample having heat-insulated side surfaces are temperature-controlled at a given temperature and temperature in the contact plane is measured. The reference sample is made from two identical stacks comprising flat plates stacked in parallel to the plane of thermal contact, the thickness of said plates being defined by pressure tolerated by the analysed sample. One of the stacks is first installed in place of the analysed sample. The average thermal resistance of both stacks is determined and its double value is used when determining heat conductivity of the analysed sample.
EFFECT: temperature flexural deformation of the reference sample is compensated for by mechanical pressure tolerated by the analysed sample.
1 dwg
