FIELD: chemistry.
SUBSTANCE: method involves depositing onto a nickel substrate an active layer based on nickel and sulphur by dipping said substrate once into a solution containing sodium sulphide, which is carried out in an etching solution containing aluminium chloride AlCl3 with concentration of 5-20 g/l, for 1-17 hours.
EFFECT: forming a finely dispersed composition based on aluminium, nickel and sulphur, which can further be activated by reducing in a hydrogen atmosphere.
2 cl
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