SEMICONDUCTOR CHIP AND ITS STRUCTURE FOR INSTALLATION Russian patent published in 2013 - IPC H01L21/60 

Abstract RU 2487435 C1

FIELD: electrical engineering.

SUBSTANCE: in the chip that includes a group of input contact stubs consisting of variety of input contact stubs located in the line along one long side of its lower surface and a group of output contact stubs consisting of variety of output contact stubs located in staggered ordering along the other long side of the lower surface there is a group of nonworking contact stubs in the area between the group of input contact stubs and the group of output contact stubs. The group of nonworking contact stubs includes variety of rectangular nonworking contact stubs that do not fulfil a function of electrical connection and have a long side along the direction perpendicular to long sides of the lower surface.

EFFECT: reduced distance between contacts; the chip is capable to prevent formation of unreliable connection between the chip and substrate where the chip is installed.

18 cl, 22 dwg

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RU 2 487 435 C1

Authors

Siota Motodzi

Nakakhama Khiroki

Matsui Takasi

Khoriguti Takesi

Dates

2013-07-10Published

2010-02-02Filed