FIELD: process engineering.
SUBSTANCE: invention may be used in soldering and tinning nickel alloys, stainless and carbon steels by extra quick solders. Said solders represent tin-, indium- and bismuth-based alloys with soldering temperature below or equal to 140°C. Flux for soldering comprises the following components at the following ratio, wt %: oxalic acid - 1-62.5, amine hydrohalide - 0.2-12.5, glycerin - 20-98.3, water making the rest.
EFFECT: simple production of flux, available and cheap components, no toxic or carcinogenic substances.
4 tbl
Title | Year | Author | Number |
---|---|---|---|
CHLORIDE FLUX FOR SOLDERING | 2015 |
|
RU2599063C1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2004 |
|
RU2263569C1 |
FLUX FOR SOLDERING AND TINNING COPPER WIRE | 2020 |
|
RU2741607C1 |
PASTE FOR SOLDERING | 0 |
|
SU1555091A1 |
SOLDERING PASTE FOR LOW-TEMPERATURE SOLDERING | 0 |
|
SU1530390A1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463145C2 |
WATER SOLUBLE FLUX FOR SOLDERING | 2019 |
|
RU2705190C1 |
FLUX FOR LOW-TEMPERATURE SOLDERING OF COPPER | 0 |
|
SU1278168A1 |
SOLDERING PASTE BINDER | 2011 |
|
RU2454308C1 |
FLUX FOR LOW-TEMPERATURE SOLDERING | 2010 |
|
RU2463144C2 |
Authors
Dates
2013-07-27—Published
2012-05-29—Filed