FIELD: physics.
SUBSTANCE: in the method of assembling microelectronic components, once a position fixing polymer (4), in order to maintain alignment of microelectronic components (2) that are assembled on a substrate (1) using an anisotropic electroconductive film (7), is applied onto the substrate and hardened, the microelectronic components (2) are heated to a predetermined temperature and compressed at a predetermined pressure using a flexible sheet (5) provided on the microelectronic components and then subjected to single-step compressive fixation on the substrate (1).
EFFECT: providing a method of assembling microelectronic components which, when using an anisotropic electroconductive film to assemble a plurality of microelectronic components of different height on a base plate, allows assembling at precise positions on the base plate, thereby preventing position shift which results from compressive fixation.
5 cl, 16 dwg
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