FIELD: physics.
SUBSTANCE: invention relates to PC (printed-circuit board) structure, in particular, to PC flexible structure with application of silicone layer for combination of metal layer and substrate. Flexible printed-circuit board includes substrate made of non-metal; a first cured layer of modified silicone which is provided on and in contact with the substrate and which includes a first silicone material which is solidified; metal layer made from at least one metal; a second hardened layer of modified silicone which is provided on and in contact with the metal layer and which includes a second silicone material which is solidified; and a silicone adhesive layer placed between and in contact with the first hardened layer of modified silicone and the second hardened layer of modified silicone and which includes an adhesive silicone material which is cured by thermal polymerisation after its layering between the first cured layer of modified silicone and the second hardened layer of modified silicone.
EFFECT: invention improves adhesion and reduces delamination.
13 cl, 7 dwg
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