METHOD OF MAKING RADIOELECTRONIC COMPONENTS Russian patent published in 2016 - IPC H05K3/46 

FIELD: radio engineering, communication.

SUBSTANCE: method comprises forming windows on a rigid board, the said windows corresponding to the dimensions of chips to be mounted in the said windows with defined clearance, wherein the upper side of the chips, having integrated circuit contact pads, is directed upwards; further, using photomasks, making single-layer flexible boards, consecutively combining and softening the contact pads of the chips on the conductor of the flexible board through the pre-formed windows in the dielectric layers of the flexible board is carried out; layer-wise combination of the flexible board with the rigid board to form in its volume windows for electronic components; further, through the windows in the dielectric layers of the flexible board, softening or unsoldering the single-layer flexible boards with each other and the rigid board; bonding the back sides of the electronic component and the rigid board with each other using an adhesive film, and depositing on the front side a layer of photoresist or a different protective dielectric to form a planar radioelectronic component based on a multilayer flexible-rigid board.

EFFECT: high operational reliability of planar radioelectronic components, providing reliable switching of three or more board layers, high percentage of non-defective components.

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