ALLOYING OF LEAD-FREE SOLDERING ALLOYS AND STRUCTURES FORMED THEREWITH Russian patent published in 2013 - IPC H01L21/60

Abstract RU 2492547 C2

FIELD: metallurgy.

SUBSTANCE: proposed method comprises alloying lead-free alloy with nickel whereat nickel content approximates to 1-2 ppm and applying alloy on substrate copper bedding. Invention covers also micro-electronic structures.

EFFECT: better strength of solder joints and resistance to electromigration in micro-electronic cases.

29 cl, 5 dwg

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RU 2 492 547 C2

Authors

Pang Menchzhi

Dzhurumurti Sharan

Dates

2013-09-10—Published

2009-12-08—Filed