FIELD: metallurgy.
SUBSTANCE: lead-free solder contains, by wt %: Zn 4-12, Bi 0.5-4, In 0.5-5, P 0.005-0.5, Zr 0.001-0.5,at least one element selected from the group consisting of: Y 0-0.1, 0-0.2 Ge, Mg 0- 0.05 In 0-0.02, Al 0-0.05, Ni 0-0.2 and Ag 0-0.3, Sn - the rest.
EFFECT: solder is characterized by a low melting point and high resistance.
2 tbl, 10 ex
| Title | Year | Author | Number |
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| LEAD FREE SOLDER | 2000 |
|
RU2254971C2 |
| LEAD-FREE SOLDER | 2015 |
|
RU2695791C2 |
| SOLDERING COMPOSITIONS | 2012 |
|
RU2627822C2 |
| LEAD-FREE SOLDER | 2015 |
|
RU2662176C2 |
| METHOD OF MAKING TIN-BASED LEAD-FREE SOLDER | 2011 |
|
RU2477205C1 |
| ALUMINIUM BRAZING SHEET | 2010 |
|
RU2537052C2 |
| REPLANISHABLE LEADLESS SOLDER AND METHOD OF CONCENTRATING COPPER AND NICKEL IN SOLDERING BATH | 2006 |
|
RU2410222C2 |
| METHOD OF MAKING TIN-BASED SOLDER | 2013 |
|
RU2541249C2 |
| MULTILAYER ALUMINIUM SHEET FOR FLUX-FREE HIGH TEMPERATURE BRAZING IN CONTROLLED ATMOSPHERE | 2013 |
|
RU2642245C2 |
| SOLDER ALLOY, SOLDER BALL LEAD, SOLDER FOR MICROCIRCUIT CHIP, SOLDER PASTE AND SOLDERED JOINT | 2017 |
|
RU2688980C1 |
