METHOD FOR PRODUCING THICK-FILM RESISTORS Russian patent published in 2022 - IPC H01C17/06 H01C17/65 

FIELD: electronic technology.

SUBSTANCE: invention relates to electronic technology, namely to the production of permanent resistors, including as part of hybrid integrated circuits; it can be used in electronic, radio engineering and other related industries. Planar contacts are formed on insulating substrate by applying conductive paste by screen printing on the front surface of substrate, on which a resistive layer will be formed, followed by its burning, while preliminary annealing is carried out at a temperature of 700-790°C, a temperature change with an amplitude of ±5°C for 5-7 minutes, and then burning with ultrasonic exposure with a frequency of 60-70 kHz and an amplitude of 0.1-0.3 mcm at a temperature of 810-850°C.

EFFECT: increase in the thermal coefficient of resistance by improving the uniformity of formed resistive layers; the proposed method provides an increase in the yield of suitable thick-film resistors while reducing the process time and ensures high compliance with the specified parameters.

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