DEVICE FOR COOLING POWER SEMICONDUCTOR DEVICES Russian patent published in 2013 - IPC H01L23/34 

FIELD: electricity.

SUBSTANCE: in a device for cooling power semiconductor devices, which includes a condenser made of a piece of pressed profile with external finning and internal condensation channels, which is connected to an evaporator, inside which there located is boiling intensifier, an independent condenser is located at the distance of 1-3 metres above from the evaporator filled with liquid intermediate heat carrier, and connected to the evaporator through a steam line and a condensate line that is connected to the evaporator through nozzles.

EFFECT: invention allows improving efficiency of a cooling device, improving its manufacturability, reducing material consumption, differentiating the design of the device depending on levels of capabilities of heat losses of cooled power semiconductor devices.

6 cl, 1 dwg