FIELD: chemistry.
SUBSTANCE: press material for sealing integrated microcircuits contains binder - o-cresol novolac epoxy resin with softening point of 50-65°C, a curing agent - cyan-acetic ester and diglycidyl ether of 1,4-butanediol, an accelerating atent - N1-(3,4-dichlorophenyl)-N,N-dimethylurea, filler - ground quartz, glycidyloxypropyltrimethoxy silane finishing agent, lubricant - oxidised polyethylene wax.
EFFECT: invention enables to obtain press material which is characterised by high spiral fluidity and improved processability and longer shelf life.
1 tbl, 3 ex
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Authors
Dates
2014-01-27—Published
2012-06-14—Filed