PRESS MATERIAL FOR SEALING INTEGRATED MICROCIRCUITS Russian patent published in 2014 - IPC C08L63/00 C08L63/04 C09K3/10 

Abstract RU 2505567 C1

FIELD: chemistry.

SUBSTANCE: press material for sealing integrated microcircuits contains binder - o-cresol novolac epoxy resin with softening point of 50-65°C, a curing agent - cyan-acetic ester and diglycidyl ether of 1,4-butanediol, an accelerating atent - N1-(3,4-dichlorophenyl)-N,N-dimethylurea, filler - ground quartz, glycidyloxypropyltrimethoxy silane finishing agent, lubricant - oxidised polyethylene wax.

EFFECT: invention enables to obtain press material which is characterised by high spiral fluidity and improved processability and longer shelf life.

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RU 2 505 567 C1

Authors

Kazakov Svjatoslav Igorevich

Prudskova Tat'Jana Nikolaevna

Chivanova Larisa Jul'Evna

Dates

2014-01-27Published

2012-06-14Filed