POLYMER COMPOSITION FOR SEALING INTEGRATED CIRCUITS Russian patent published in 2017 - IPC C08L63/04 C09K3/10 

FIELD: chemistry.

SUBSTANCE: polymer composition comprises 27.3-28.1% by weight binder - ortho krezolnovolachnoy epoxy resin having a softening point 50-65°C - the polycondensation product of ortho-cresol with paraformaldehyde in an equimolar ratio at first in the presence of oxalic acid to achieve 35-. 45% conversion, then in the presence of p-toluenesulfonic acid to complete the reaction and then reacting the resultant product with epichlorohydrin in an alkaline environment - 13.5-13.8% by weight of curing agent -. novolac phenolic resin grade SF-015, fillers including silica ground powdered 34.8-46.4 wt %, technical carbon 0.60-0.64 wt % of boron nitride and hexagonal 10.1-22.3 wt %, 0.35-0.47 wt % lubricant - oxidized polyethylene wax, 0.1-0.2 wt % coupling agent -. glycidyloxypropyltrimethoxysilane and 0.4-0.61% by weight latent accelerator - complexes of triphenylphosphine with copper chloride or cobaltous dichloride.

EFFECT: invention provides a polymer composition with a controlled viscosity increase in the high temperature homogenization on the rollers, and curing with uniform increased shelf life.

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