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2 640 542

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(51)

IPC

C08L63/04(2006-01-01)

C09K3/10(2006-01-01)

C08K13/02(2006-01-01)

(21) (22)

Application

2016148224, 2016-12-08

(24)

Start date

2016-12-08

(22)

Actual filing date

2016-12-08

(45)

Published

2018-01-09

(72)

Inventor

Kazakov Svyatoslav IgorevichPrudskova Tatyana NikolaevnaChivanova Larisa Yulevna

(73)

Holder

Rossijskaya Federatsiya, Ot Imeni Kotoroj Vystupaet Ministerstvo Promyshlennosti I Torgovli Rossijskoj Federatsii

POLYMER COMPOSITION FOR SEALING INTEGRATED CIRCUITS Russian patent published in 2018 - IPC C08L63/04 C09K3/10 C08K13/02

Abstract RU 2640542 C1

FIELD: chemistry.

SUBSTANCE: composition includes a binder - ortho-cresol-novolac epoxy resin with a softening temperature of 50-65°C, a curing agent - phenol novolac resin, fillers - a silica filler and a carbon black filler, lubricant - oxidised polyethylene wax, finish - glycidyloxypropyltrimethoxysilane and a latent accelerator. As a latent accelerator, triphenylphosphine complex compounds are used with nickel thiocyanate or nickel thiocyanate with 2-methylimidazole, and as a silica filler - ground dust quartz or a mixture of amorphous fused quartz.

EFFECT: development of a polymer composition characterized by controlled viscosity growth during high-temperature homogenization on rolls, uniform curing and extended shelf life.

1 tbl, 6 ex

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RU 2 640 542 C1

Authors

Kazakov Svyatoslav Igorevich

Prudskova Tatyana Nikolaevna

Chivanova Larisa Yulevna

Dates

2018-01-09—Published

2016-12-08—Filed