FIELD: chemistry.
SUBSTANCE: invention relates to phenol-formaldehyde-based adhesives which can be used in metallurgical, aerospace, automobile and other industries, where adhesive joints are exposed to moderate (up to 10-15 MPa) mechanical loads and temperature ranging from normal (20°C) to high (1100-1200°C) in inert or weakly acidic media. The adhesive contains modified novolac-type phenol-formaldehyde resin, urotropin and powdered filler. The powdered filler is powdered silicon and boron. The adhesive further contains nano-filler. The nano-filler is a mixture of silicon and boron taken in ratio of 1:2 with average particle size of 80 nm.
EFFECT: adhesive increases bonding strength of carbon and carbon-carbon composite materials to values that are close to strength of the glued materials in a wide temperature range.
3 tbl
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Authors
Dates
2014-02-27—Published
2012-03-05—Filed