FIELD: adhesives.
SUBSTANCE: invention relates to heat-resistant modified glue compositions based on phenol-formaldehyde resins characterized by high strength of glued connections at 400-450°C and designed for gluing together various-destination structures, including aviation engineering parts. Composition comprises novolac phenol-formaldehyde resin, resol phenol-formaldehyde resin, organosilicon oligomer-hydroxyl-containing titanium-organosilicon oligomer in the form of acetone solution, organic solvent (ethyl alcohol), and fillers: aluminum powder and amorphous boron.
EFFECT: increased sheer strength of glued connections at high temperatures with initial strength of glued connections preserved.
2 tbl, 4 ex
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Authors
Dates
2006-05-20—Published
2004-11-29—Filed