FIELD: organic chemistry, in particular adhesives based on modified phenol-formaldehyde resin.
SUBSTANCE: claimed adhesive contains novolak-type modified phenol-formaldehyde resin, fine dispersed powdered filler, active solvent such as furfural and furfuralcohol mixture in ratio from 1:9 to 9:1 and combined acid catalyst (e.g. mixture of benzenesulfoacid with tin tetrachloride in ratio from 1:9 to 9:1). Adhesives of present invention are useful in joint of carbon and ceramic materials operating at high temperatures (up to 1600-1800°C).
EFFECT: new heat resistant adhesive.
2 tbl
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Authors
Dates
2006-01-20—Published
2004-03-17—Filed