FIELD: chemistry.
SUBSTANCE: invention relates to high-temperature compositions for room hardening for gluing carbon—carbon composite materials, heat-insulating materials and metals to each other. Disclosed is an adhesive composition containing, wt h: modified epoxy resin—25–35, polyamide resin L-20—5–15, 3-aminopropyltriethoxysilane AGM-9—10–15, boron carbide—50–70.
EFFECT: increased elasticity of adhesive joints at short-term exposure to temperature of not less than 1000 °C.
1 cl, 6 tbl
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Authors
Dates
2020-09-24—Published
2019-02-22—Filed