FIELD: physics.
SUBSTANCE: solid-state imaging device includes a substrate, an image sensor region and a signal processing circuit, which are electrically connected to each other, a low-heat conductivity region situated between the image sensor region and the signal processing circuit, and a through hole formed in the substrate. The low-heat conductivity region is situated in the through hole and has lower heat conductivity than the substrate.
EFFECT: easy reduction of dimensions and improved quality of the captured images.
19 cl, 25 dwg
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|---|---|---|---|
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