FIELD: physics.
SUBSTANCE: invention relates to microelectronics and can be used to increase yield ratio when manufacturing high-density electronic modules. When manufacturing high-density electronic modules by forming built-in passive elements, directly assembling active elements (chips) and layered formation of interconnections before manufacturing and assembling the electronic elements, a modification of the circuit is produced, which is intended only for testing thereof, and multifunctional probing of operating capacity of each element is carried out using processing procedures after forming passive elements and assembling active elements and before forming interconnections.
EFFECT: wider range of methods of lowering the cost of manufacturing high-density electronic modules, high yield ratio.
7 dwg
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