FIELD: manufacturing technology.
SUBSTANCE: use for the manufacture of integrated circuits (IC), hybrid integrated circuits (HIC), microassemblies and modules. Essence of the invention lies in the fact that on the contact areas of the crystal, ball leads are formed from the platinum wire by the thermo-sound welding method, and after the planarization of the ball leads, a solder ball is applied to them for subsequent soldering the crystal to the body / substrate using the "flip-chip" technology.
EFFECT: providing the possibility of increasing reliability and rapid prototyping without the use of templates.
1 cl, 3 dwg
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