FIELD: physics.
SUBSTANCE: group of inventions relates to a cooling assembly for a power semiconductor device (100). The assembly comprises an actively cooled heat sink (102) and a controller (208; 300), wherein the controller (208; 300) is configured to adjust the cooling efficiency of the heat sink (102) depending on the temperature of the high current carrying semiconductor junction contained in the power semiconductor device (100), wherein the controller (208; 300) is configured to receive a temperature signal which specifies an actually measured temperature value of the high current carrying semiconductor junction, wherein the controller (208; 300) comprises a selection module configured to choose between a feedback control mode and a feed forward control mode for adjusting the cooling efficiency.
EFFECT: invention enables to control cooling depending on temperature of the high current carrying semiconductor junction.
9 cl, 5 dwg
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