REACTIVE SOLDERING ASSEMBLY METHOD AND VACUUM CHUCK ASSEMBLED BY THIS METHOD Russian patent published in 2014 - IPC B23K1/00 C04B37/02 H01H33/66 

FIELD: machine building.

SUBSTANCE: invention can be used to connect metal elements by reactive soldering, namely connect the first element in the form of an end cover (5, 6) of a vacuum chuck to the second element in the form of cylindrical case (4) using a process alloy. The first metal element contains nickel and silver. The second element contains ionic-covalent oxide at least on its surface. The process alloy forms a liquid solder (1) containing titanium and silver and providing for wetting of the surfaces to be connected. The alloy composition is chosen with regard to the nickel content in the first element so that to provide for stable reaction layer of specified thickness on the border of the second element and minimise the formation of metallides in the soldered connection.

EFFECT: provision for proper wetting of the second element surface by the solder and prevention of metallides result in high strength of a soldered connection.

12 cl, 5 dwg