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IPC

H05K5/06(2006-01-01)

H01L23/28(2006-01-01)

(21) (22)

Application

2013136329/07, 2013-08-01

(24)

Start date

2013-08-01

(22)

Actual filing date

2013-08-01

(45)

Published

2015-03-27

(72)

Inventor

Karachinov Vladimir AleksandrovichPetrova Ol'Ga Mikhajlovna

(73)

Holder

Otkrytoe Aktsionernoe Obshchestvo Konstruktorsko-Tekhnologicheskoe Bjuro Po Relejnoj Tekhnike" Rt")

MODULE SEALED CASE AND METHOD OF ITS FABRICATION Russian patent published in 2015 - IPC H05K5/06 H01L23/28

Abstract RU 2545019 C2

FIELD: process engineering.

SUBSTANCE: invention relates to radio electronic hardware, particularly, to device cases with stringent requirements to tightness and heat sink. This case consists of shell with outer electric lead-outs, base and cover. Note here that groove shaped to dihedral angle with cavity conjugated with angle vertex is made on top and bottom surfaces of said shell as well as on inner surfaces of said base and cover over soldering outline.

EFFECT: longer term of tightness.

3 cl, 1 dwg

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RU 2 545 019 C2

Authors

Karachinov Vladimir Aleksandrovich

Petrova Ol'Ga Mikhajlovna

Dates

2015-03-27—Published

2013-08-01—Filed