SEALED MICROMODULE CASE AND ITS MANUFACTURING PROCESS Russian patent published in 1995 - IPC

FIELD: radio electronic engineering. SUBSTANCE: case having aluminium-alloy base 1 and at least one cover 2 joined together and sealed over perimeter is provided with titanium-alloy frames 3,4 attached to base 1 and cover 2 by diffusion welding at their joint and welded together over perimeter. For manufacturing mentioned case new process is proposed involving manufacture of titanium-alloy frames 3,4 along with base 1 and cover 2; base 1 and cover 2 are assembled with respective frames 3 and 4, the latter are joined with respective base 1 and cover 2 by diffusion welding in vacuum, base-to-cover joint is checked for tightness, then entire case is assembled and frames 3 and 4 are welded together. EFFECT: improved sealing of case at good weight and heat transfer characteristics of aluminium-alloy cases. 8 cl, 2 dwg