IC COOLING DEVICE Russian patent published in 2014 - IPC H01L23/38 H01L23/373 

FIELD: electricity.

SUBSTANCE: in a IC cooling device operated on Peltier effect principle, an aluminium heat splitter is glued to the IC ceramic case and a cooling semiconductor unit using the Peltier effect is glued on the splitter. The IC case bottom is at the same time a top heat transfer path of the cooling semiconductor unit, soldering of dice to the substrate and of the substrate with the case bottom (upper heat transfer path of a TEM), upper heat transfer path with one surface of semiconducting legs of p- and n-type is carried out under the temperature which is by 20-25°C lower than the temperature of soldering of the other surface of semiconducting legs to the lower heat transfer path; the semiconducting legs are set between the heat transfer paths so that all hot surfaces are in contact with one heat transfer path and all cold surfaces - with the opposite path and they are connected into a common electric circuit by metallisation with the said circuit being connected to a power source, a thermocouple is fixed to the IC case to control its temperature, the thermocouple is connected to the power source's polarity switching unit to stabilise the temperature (for heating or cooling).

EFFECT: increased heat transfer from the dice to the case, simplified assembly process with the usage of heat sinks on the Peltier effect basis.

7 dwg