FLUID COOLING SYSTEM FOR SEMICONDUCTOR DEVICES Russian patent published in 2015 - IPC F25B19/04 

FIELD: heating.

SUBSTANCE: invention refers to instrumentation, heat supply and refrigeration and can be applied in thermostatic control systems with fluid heat carrier. Invention substance covers fluid cooling system for semiconductor devices, including circulation loop including pumps, heat exchanger, ion exchange filter, cooler connected parallel to the pumps, make-up vessel set above any circulation loop section and connected to suction pump line, instruments, and additional pulser, hydraulic accumulator, check valve, feed and invert valves. Cooler is connected parallel to the pulser connected to the circulation loop in sequence via feed and invert valves, check valve is mounted in feed pipeline of the cooler, and hydraulic accumulator is mounted in reverse pipeline of the cooler before invert valve.

EFFECT: improved operation reliability and efficiency of fluid cooling system for semiconductor device.

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