FIELD: process engineering.
SUBSTANCE: invention relates to electroplating, particularly, to appropriate electroplating hardware and can be used for electroplating of loose small parts, in particular, for electroplating of chip-resistor external contacts. This line comprises processing baths for degreasing, flushing, etching and application of coatings, i.e. nickel and solder plies. Besides, it includes parts conveyor. Note here that said baths are equipped with ACS for maintenance of required temperature and manipulators provided with basket vibrating suspensions. The latter are provided with drain plugs with orifices stopped by poultry netting for coating application with vibratory mixing and bath for cascade counter-flow flushing.
EFFECT: decreased amount of effluents and flushing waters, reduced production area.
1 dwg
Authors
Dates
2015-06-10—Published
2013-07-16—Filed