FIELD: chemistry.
SUBSTANCE: hot-curing epoxy composition includes epoxy-diane oligomer of grade ED-20, curing agent - iso-methyltetrahydriphthalic anhydride (iso-MTHPA) and catalyst of polymerisation reaction. As catalyst it contains aminomethylterpenephenol compounds. Composition contains components with their following content (wt.p.): epoxy oligomer - 100, iso-MTHPA - 80, catalyst - 1-2. As aminomethylterpenephenol compounds used is 4-dimethylaminomethyl-2,6-diisobornylphenol or 6-dimethylaminomethyl-4-methyl-2-isobornylphenol.
EFFECT: increased thermal resistance and mechanical strength of products from said composition.
2 tbl, 6 ex
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Authors
Dates
2015-08-10—Published
2014-02-17—Filed