FIELD: printing.
SUBSTANCE: invention relates to a technology of connecting the element of the integrated circuit (chip) to the surface which comprises conductive patterns. First, the chip (201) is heated to a first temperature lower than the temperature that the chip can endure without damage by heat. The heated chip is pressed against the printed conductive surface with a first pressing force. Joint action of the first temperature and the first pressing force is sufficient to at least partially melt the material of the printed conductive surface and/or the corresponding contact point on the chip (205, 206).
EFFECT: creation of the method and device for rapid, smooth and reliable connection of the chip to the printed conductive surface due to the point-like nature of heat transfer and applying pressure to the surface at the contact points.
15 cl, 13 dwg
